A line by line analysis of update commentary. All super positive.
HBM as a Major DriverHBM remains a key driver for innovation, industry growth, and product differentiation. Micron previously set a goal to reach similar HBM bit share levels to its overall DRAM bit share (achieved in 3Q25).
As Samsung gains incremental share in CY26, Micron is expected to maintain or grow its position into CY27.
Next-generation HBM products will incorporate custom logic base dies, with initial adoption in HBM4E and broader uptake in HBM5.
Hybrid bonding is planned (not expected before HBM5 in 2028-2029).
Customisation and complexity in HBM are expected to drive higher profitability industry-wide.
Micron highlighted HBM as representing a high-teens percentage of wafers, with strong expectations for continued growth to meet future demand.
Dare One Say the Cycle Is Different This Time?Management views the current cycle as structurally different due to:AI and data centre demand making memory a more strategic asset.
Greater customer collaboration on roadmaps.
Significant innovation (LPDDR5/6, SOCAMM, High Capacity DIMMs, GDDR6, HBM4/4E).
Multi-year lead times for supply additions (3+ years from shovels to equipment). No quick fix to meeting unmet demand
Worsening trade ratios for HBM and potential imbalances (moving to 4-to-1 and higher in the HBM4/5 transition) further support a tight environment. This is a positive and refers to allocating HBM over other DRAM the trade ratio is the trade-off which means other types of memory experiencing more supply constraint vs demand as a shift to HBM continues (Wafers being the common real estate). And remember, Wafers or WFE are limited, so allocation to various types of memory matters, causing potential imbalance elsewhere. More WFE starts = more equipment-ASML/KLAC, more raw materials, copper, interconnects, foundries and so on.
Strategic Customer Agreements (SCA)Micron recently initiated Strategic Customer Agreements (SCA), offering 5-year terms with “durable/sustainable” commitments and a critical focus on appropriate ROI for Capex.
Investors are awaiting more details, but management sees these as potentially providing greater durability to the business.Gross Margins and Path Forward-Micron guided May quarter gross margins of 81%.
The firm does not view 45% as a “normalised” level (despite current market pricing implying it).
Management remains positive on gross margins beyond May and highlighted a market shift toward pricing on a bandwidth basis (beneficial for customers and the pricing environment).
Capex Outlook-Micron announced a substantial increase in Net Capex for FY26 to $25B (from prior ~$20B).
Further meaningful step-up expected in FY27 (construction-related Capex +$10B+ YoY; WFE spend also rising).
Expected FY27 Capex: $37B+.
Focus on expeditiously building clean room space, then equipping as needed, with a disciplined approach.
All manufacturing remains focused on becoming EUV-capable to support advanced HBM and leading-edge DRAM (layer counts moving from 1-2 to 3-5). This is stacking layers.
Today Micron is only able to meet customer orders at between 50-63% customer variable/mix. The demand supply imbalance is getting worse-the vibe is the imbalance will last into 2030 maybe beyond. Management feel that high gross margins are the new norm. My takeaway is $20-$25 quarterly EPS is the new base line.