Cutting Edge Chip News
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TSMC plans to begin construction of its 3rd Arizona fab in June, a year ahead of schedule.
TSMC also reportedly asked suppliers of advanced packaging machinery to ready equipment to be exported to the US, a sign it will begin construction of an Arizona packaging plant soon
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Micron Technology is boosting production of HBM (high bandwidth memory) chips, the AI memory chip, with fresh equipment orders for TC bonders, including 30 from South Korea’s Hanmi Semiconductor and an unknown amount from Japan’s Shinkawa, media report, noting Hanmi’s equipment can be used for more advanced HBM3e 12Hi, while Shinkawa’s equipment is for 8Hi products.
Both Nvidia and Broadcomm are pushing their suppliers for 'more' memory as demand continues to surge.
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SK hynix raises its 2025 CAPEX from $15 billion to $19 billion.
SK Hynix has decided to increase its planned CAPEX this year by 30% due to the surge in demand for high-bandwidth memory (HBM), which was already high.
The chipmaker initially planned to spend 22 trillion won this year in expanding its facilities but this has been upped to 29 trillion won, sources said.
The decision was recently finalised and SK Hynix has also sent memos to suppliers to deliver the equipment to the M15X fab in Chungju by October, two months faster than initially planned.
These moves are all responses from its customers requesting SK Hynix deliver more HBM chips faster.
The company’s main customer is Nvidia, which is using HBM with its AI accelerators. The GPU giant is requesting SK Hynix deliver HBM faster than planned. SK Hynix will also be supplying HBMs to Broadcom starting this year.
We are reading the room, folks. Demand is off the hook and I would speculate, supply is also improving.
Whilst the market is distracted by and shunning everything due to tariffs speculation, these businesses are clearly articulating a shift.